| abstract |
One method of making an extra low-k (ELK) intermetal dielectric (IMD) layer comprises forming a first IMD layer comprising a plurality of dielectric material layers over a substrate. An adhesive layer is made over the first IMD layer. Over the adhesive layer, a dielectric ELK layer is produced. A protective layer is formed over the dielectric ELK layer. Over the protective layer, a hard mask is made and patterned to create a window. Layers under the window are removed to create an opening. The removed layers include the protective layer, the ELK dielectric layer, the adhesion layer, and the first IMD layer. In the opening, a metal layer is formed. |