http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017117411-A1

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filingDate 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b469046ac4e4a5f1235a36416000f7d
publicationDate 2019-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102017117411-A1
titleOfInvention Leadframe assembly and manufacturing process for optoelectronic semiconductor devices
abstract In one embodiment, the production method for semiconductor components (1) comprises the following steps: A) providing a lead frame composite (2) with lead frames (22), B) fitting the lead frames (22) with optoelectronic semiconductor chips (3), C) generating a functional body ( 4) on the lead frame (22) and / or on the semiconductor chips (3), D) attaching an exciter coil (8) to an induction opening (28) and energizing the semiconductor chip (3) in the test field (26) by induction, andE) Dicing to the semiconductor devices (1), wherein each of the semiconductor devices (1) comprises exactly one of the lead frames (22) from the component field (21) and the edge region (25) is discarded.
priorityDate 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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