http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017115879-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7d6e9601bf58ae0e005d0a5eec9dc9fb |
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| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-328 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-21 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R12-51 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-21 |
| filingDate | 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_167e580dd638913b3e818397d0671e67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07452b42c8ea832c528f0d95a793eb41 |
| publicationDate | 2021-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102017115879-B4 |
| titleOfInvention | Process for the production of a power electronic submodule by means of a welding process |
| abstract | Method for producing a power electronic submodule (1) with an electrically insulating circuit carrier (20), a metallic conductor track (22) and a connection element (5) connected to it in an electrically conductive manner, with the method steps: a. Provision of the circuit carrier (20) with a metallic conductor track (22) which is arranged on a first main surface and has a first contact surface (220) which is provided for this purpose in a materially and electrically conductive manner with a second contact surface (520) of the connection element (5) The conductor track (22) in the area of the first contact surface (220) is formed by a metal foil with a thickness between 200 μm and 500 μm and with a mass fraction of at least 80% copper; b. Arranging the connection element (5) for the conductor track (22), the first and second contact surfaces (220, 520) touching one another or being at a distance (620) of less than 300 μm from one another; c. Exposure of a partial area (540) of the surface (54) of the connection element (5) facing away, i.e. opposite the second contact area (520), to laser radiation, forming a welded connection between the conductor track (22) and the connection element (5), the conductor track ( 22) is locally melted only to a depth (620) of a maximum of 90% of its thickness (210), the wavelength of the laser being between 900nm and 1300nm and the focus diameter (D) of the laser beam (6) of the condition 3λ <D <10A, obey. |
| priorityDate | 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.