http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017108172-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_59c820ad08f8533c7440ae1d9235b168 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-40245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49548 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4951 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4825 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49524 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2017-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e957117e248603bc0c4782c4063e56b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_097c3a0c955c26cab2026a317a5c0ba2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8a8e45224ffc4af9e16b1a8fa2d08a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e2d0d4bbb69bcccd2cc88c36335a514 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de81289d26785a8e560320a06e394f2c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fb8e363d5ae300954570f51ca9155f8 |
| publicationDate | 2022-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102017108172-B4 |
| titleOfInvention | SMD package and method for manufacturing an SMD package |
| abstract | Package (2) enclosing a power semiconductor die (1), the package (2) having a package top (201) and a package bottom (202), the die (1) having a first load terminal (11) on a die front side (101) facing the package bottom (202) and a second load connection (12) which is arranged on a die rear side (102) facing the package top side (201), the package ( 2) includes the following: - A lead frame (21) which is designed for electrically and mechanically coupling the package (2) to a carrier (3), the lead frame (21) having a planar first external connection (211) which is electrically connected to the first load connection (11). and a planar second outer terminal (212) electrically connected to the second load terminal (12); and where - The planar first external connection (211) is designed to form an interface with the carrier (3) by means of a first contact surface (31); and - the planar second external terminal (212) is adapted to form an interface with the carrier (3) by means of a second contact area (32), the second contact area (32) having a size which is within the range of 80% to 120% of a Size of the first contact surface (31) is, and where - the enclosed die (1) has a further connection on the die front side (101); - the lead frame (21) has a planar third external connection (213) which is electrically connected to the further connection and is electrically insulated from both the first external connection (211) and the second external connection (212); - The planar third external connection (213) is designed to form an interface with the carrier (3) by means of a third contact surface (33); and - The first contact area (31), the second contact area (32) and the third contact area (33) each overlap laterally at least partially with the enclosed die (1). |
| priorityDate | 2017-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.