| abstract |
The semiconductor device includes a multilayered substrate provided with an insulating plate and a circuit board, a semiconductor chip having a front side and a back side, the front side being connected to a main electrode and a control electrode formed thereon, and the back side connected to the circuit board A first wiring substrate having a first conductive member and disposed so as to oppose the main electrode electrically connected to the first conductive member, a second wiring substrate having a second conductive member and disposed facing the control electrode, and an opening, and a conductive post having a first end and another end, the first end being electrically and mechanically connected to the control electrode, and the other end being electrically and mechanically connected to the second conductive element is, wherein the first conductive element is thicker than the second conductive element, and the first wiring substrate is disposed within the opening. |