| abstract |
The present invention describes a latent-reactive adhesive film having a top side and a bottom side comprising a thermoplastic component having a melting temperature T (enamel) of 35 ° C ≤ T (enamel) ≤ 90 ° C, especially 40 ° C ≤ T (enamel) ≤ 60 ° C, and contains functional groups that can react with isocyanate; and an isocyanate-containing component which is particulate, i. is dispersed in the form of particles in the thermoplastic component and is substantially deactivated in the region of the particle surface, wherein the particles have a light-off temperature T (light off) of 40 ° C ≤ T (light off) ≤ 100 ° C and wherein T (light-off) ≥ T (enamel) is where the top and / or bottom is plasma treated. Also described are adhesive products comprising at least the latent-reactive adhesive film, as well as the use of the latent-reactive adhesive film or the adhesive product for producing a bond with improved moisture-heat resistance. Finally, a laminate and a method for bonding two substrates are described. |