http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102016125348-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e1a3f8d9ffe77afaf6f49a884e0f2f26 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3731 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0061 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 |
| filingDate | 2016-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8540619449a7b6b7a781c30aa2b9533b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af69faaddafed4aa48a41b15c02883db http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ddda71fd161128908f9fa08030276d6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72d9fe50215b1737b8e7bd18532daf0d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_730e0c74a36813a534dc5f9c7ac39155 |
| publicationDate | 2020-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102016125348-B4 |
| titleOfInvention | Carrier substrate for electrical components and method for producing a carrier substrate |
| abstract | Carrier substrate (1) for electrical components (13), the carrier substrate (1) having a component side (4) and a cooling side (5) opposite the component side (4) with a cooling structure (30), the carrier substrate (1) for electrical Insulation has a primary layer (10) facing the component side (4) and made of ceramic and a stiffening of the carrier substrate (1) has a secondary layer (20) facing the cooling side (5), with heat transfer from the component side (4) to the cooling side (5 ) seen along a stacking direction between the primary layer (10) and the secondary layer (20) a single-layer metallic intermediate layer (15) is arranged, wherein the metallic intermediate layer (15) is thicker than the primary layer (10) and the secondary layer (20), wherein the carrier substrate (1), seen in the stacking direction, can be virtually dismantled into a primary substrate (10 '), a secondary substrate (20') and a virtual intermediate layer (15 ') located between them, the The primary substrate (10 ') and the secondary substrate (20') are thermomechanically symmetrical, a part of the cooling structure (30) which extends parallel to the primary layer (10) being thinner than the metallic intermediate layer (15). |
| priorityDate | 2016-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.