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filingDate 2016-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102016120883-A1
titleOfInvention An integrated device and method for integrating an inductor into a semiconductor substrate
abstract An integrated device is provided. The integrated device includes: a semiconductor substrate; an electrically conductive metal structure; a thermally conductive element extending from the electrically conductive metal structure and configured to dissipate heat from the electrically conductive metal structure, the thermally conductive element having a proximal end in contact with the electrically conductive metal structure and a distal one remote from the electrically conductive metal structure End has, the distal end is thermally floating; and an electrically insulating material that encapsulates the metal structure and the thermally conductive element, in particular the thermally floating distal end of the thermally conductive element.
priorityDate 2016-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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