| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00261
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2016-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85d5720a57a24feb289ee12ad5506fe4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7957821d87831ccbab88bafe690e21f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f08b0ee57da2fc8885f52c176617990e |
| publicationDate |
2017-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102016115067-A1 |
| titleOfInvention |
Packaging method and associated package structure |
| abstract |
The present disclosure provides a packaging method comprising: providing a first semiconductor substrate; Forming a bonding region on the first semiconductor substrate, wherein the bonding region of the first semiconductor substrate comprises a first bonding metal layer and a second bonding metal layer; Providing a second semiconductor substrate having a bonding region, the bonding region of the second semiconductor substrate having a third bonding layer; and bonding the first semiconductor substrate to the second semiconductor substrate by bringing the bonding region of the first semiconductor substrate into contact with the bonding region of the second semiconductor substrate, the first and third bonding metal layers comprising copper (Cu) and the second bonding -Metallschicht tin (Sn) has. An associated package structure is also disclosed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102021204645-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019192797-A1 |
| priorityDate |
2015-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |