| abstract |
The invention relates to a connecting element for an electronic component arrangement, comprising a carrier, a first contact pad and a second contact pad, an electrically conductive structure electrically connecting the first contact pad and the second contact pad, and a first contact conductor, which is connected to the first contact pad by means of a solder layer is electrically connected and which is configured in a second portion of the first surface and / or on the second surface to form a welded joint. The invention further relates to an electronic component arrangement with such a connection element and with at least one component welded to the contact conductor and the methods for producing the connection element and the component arrangement. |