| abstract |
The electronic component comprises a semiconductor chip having a first major surface, a second major surface opposite the first major surface, side surfaces connecting the first and second major surfaces, and a sensor element or actuator element disposed on the first major surface, and a substrate, the semiconductor chip overlying the substrate wherein the first main surface of the semiconductor chip faces the substrate, wherein the substrate comprises a substrate opening, wherein the substrate opening allows the passage of signals to the sensor element or from the actuator element. |