http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102015110859-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-32 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2015-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6031d74208c0d37665b76ff4bb11bade http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8318515a5d83dfa0d15879d5380b8da7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18a04538492a5b6a16cebdb80dee1efd |
| publicationDate | 2019-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102015110859-B4 |
| titleOfInvention | Enlarged contact area for testing leadframe strips |
| abstract | A method of testing a leadframe strip comprising a plurality of unitary leadframes connected to a periphery of the leadframe strip, each unitary leadframe having a die paddle, a plurality of leads, and a die die mounted semiconductor die, the method as follows Steps include: electrically isolating at least the leads from the periphery of the leadframe strip such that after electrical isolation from the periphery of the leadframe strip, at least some of the leads extend beyond a final lead edge outline of the unitary leadframes, testing the semiconductor dies; The paddles and the leads, which after electrical isolation from the periphery of the leadframe strip extend continuously beyond the final lead outline of the unitary leadframes, and disconnect the unitary leadframes from the leadframe strip are tested on the final lead outline of the unitary lead frame after testing the semiconductor dies. |
| priorityDate | 2014-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.