http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102015104127-A1

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e2c321c5b9b5774498f194d959bdf9df
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544
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filingDate 2015-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e65147d6929e0b936a87b3c4f4ce34e5
publicationDate 2015-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102015104127-A1
titleOfInvention Positioned probe pads for prebond testing
abstract An arrangement for performing prebond testing of a wafer of semiconductor devices uses probe pads positioned in wafer areas adjacent to the devices so that when prebond testing is complete and the wafer is separated into discrete elements, the electrical connection between the Prebond probe pad and the device under test is broken. The adjacent wafer areas may be "vacant" areas or another device area. After separation into discrete elements, a particular Prebond probe pad and its associated device are physically separated and electrically isolated from each other. Thus, a large probe pad is electrically connected to an associated device only while the wafer is intact, which facilitates placement of the probes during prebond testing. Once the devices are disconnected, the probe pad is no longer connected to the portion of its associated active element, which eliminates the capacity associated with maintaining an electrical connection between a probe and an active area at a common location.
priorityDate 2014-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 20.