| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-482
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 |
| filingDate |
2014-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e75491a8d9f5ffa3443c6991274997d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b87c29f388d50d46e90985ba45c7ec8a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b466d735ba6e3a6742bbf1fea718417
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_663fed29b734d9285722a7e3fa7274ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19b3d4ef96880539fa4e3a7cc8935113 |
| publicationDate |
2015-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102014114294-A1 |
| titleOfInvention |
ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF |
| abstract |
An assembly (100) is provided. The assembly (100) may include a die (102) having at least one electronic component (104) and a first terminal (106) on a first side (108) of the die (102) and a second terminal (110) on a first side (108) second side (112) of the nude chip (102) opposite the first side (108), wherein the first side (108) is the main processing side of the nude chip (102) and the nude chip (102) further comprises at least one third port (114) the second side (112); a first electrically conductive structure (116) providing current flow from the third terminal (114) on the second side (112) of the die (102) to the first side (108) through the die (102); a second electrically conductive structure (118) on the first side (108) of the bare chip (102) that laterally couples the second terminal (110) to the first electrically conductive structure (116); and an encapsulant material (120) disposed over at least the first side (108) of the bare chip (102) to cover the first terminal (106) and the second electrically conductive pattern (118). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102016118709-B3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10622346-B2 |
| priorityDate |
2013-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |