| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823431 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0821
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-41766
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-41758
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-73 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-739 |
| filingDate |
2014-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c21b065a99620a3c2305447c2adc6c2b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4542c9efc91eec057585cc6f786851dc |
| publicationDate |
2020-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102014101074-B4 |
| titleOfInvention |
Vias and methods of their formation |
| abstract |
Semiconductor chip, which has: a substrate (10); a component area which is arranged in or above the substrate (10); a first doped region (30, 40) disposed in the device region; a contact layer (60) arranged in the first doped region; a conductive layer (70) disposed over a first surface of the substrate and over the contact layer (60); and a first via (50) which is arranged in the substrate (10) and extends through the entire first doped region (30, 40), through the contact layer (60) and through the conductive layer (70) and from the first surface of the substrate extends to a second surface of the substrate, the first surface being disposed opposite the second surface. |
| priorityDate |
2013-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |