http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102013205881-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f3e47c6c2d8d98eacba284a73c2302a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-13 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G2-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-228 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G11-74 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-012 |
| filingDate | 2013-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff973f85b0a74aaebfbe4b1920989e7b |
| publicationDate | 2013-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102013205881-A1 |
| titleOfInvention | Solid electrolytic capacitor with increased mechanical stability under extreme conditions |
| abstract | Described is a capacitor assembly that is thermally and mechanically stable under extreme conditions. Thermal stability is achieved by confining and hermetically sealing the capacitor element within a housing in the presence of a gas atmosphere containing an inert gas, thereby limiting the amount of oxygen and moisture supplied to the solid electrolyte of the capacitor. To provide good mechanical stability, the capacitor assembly also includes at least one outer end portion (eg, anode and / or cathode end portion) that extends beyond an outer edge of a surface of the housing. The degree to which the outer end portion extends beyond the outer edge relative to the dimension of the housing is selectively controlled in the present invention to increase the portion of the area available for soldering to a printed circuit board. |
| priorityDate | 2012-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 199.