| abstract |
Provided is an integrated circuit comprising: a carrier having at least one electronic component and at least one contact surface disposed on a first side of the carrier, wherein the at least one electronic component is electrically connected to the at least one contact surface; an inorganic material layer bonded to the first side of the carrier by wafer bonding, the carrier having a first coefficient of thermal expansion, and wherein the inorganic material layer has a second coefficient of thermal expansion, the second coefficient of thermal expansion having a difference of less than 100% of the first coefficient of thermal expansion; and at least one via formed through the inorganic material layer, wherein the at least one via is in contact with the at least one contact pad. |