http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102013105400-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-364 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2013-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f9aca39111cab7f919b171df1220864 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87e40c1639c3efc05e0477c6a68c45a7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cb7a4e61a5a12c1ac521fbac20d7473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e640c7ff52a74acf733e57ec8d8bbc2 |
| publicationDate | 2018-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102013105400-B4 |
| titleOfInvention | Method of forming a bump structure |
| abstract | A method of forming a bump structure, comprising: Forming an under bump metallurgy (UBM) structure (14) on a substrate (12); Forming a copper pillar (16) on the UBM structure (14), wherein the copper pillar (16) is shaped to have a tapered arcuate profile (22), the side walls of the copper pillar (16 ) are concave along the entire length of the copper pillar; Forming a metal cap (18) on the copper pillar (16); and Forming a solder structure (20) on the metal cap (18); in which the bottom (24) of the copper pillar (16) facing the UBM structure (14) is wider than its top (26) facing the metal cap (18); and the metal cap is wider than the top of the copper pillar, where the copper pillar (16) abuts the metal cap (18); wherein the forming of the copper pillar, the metal cap and the solder structure further comprises: Applying a photoresist on the UBM structure and the substrate, creating a ladder bump profile opening in the photoresist through a photolithography process; Forming the copper pillar and the metal cap in the opening in the photoresist; Forming the solder structure on the metal cap; Removing the photoresist and etching the UBM structure, wherein the etching of the UBM structure also creates an overhang of the metal cap at the top of the copper pillar; the method further comprising: Forming a copper oxide film on the sidewalls of the copper pillar (16); Mounting the solder pattern to a second substrate (60) and inserting a underfill (64) between the substrate (12) of the bump structure and the second substrate (60), wherein the copper oxide film adheres to the underfill (64). |
| priorityDate | 2012-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.