| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2012-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ccffb76e221dd8428aff94a41f68ade
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ea63718439ac586ec1a06399c666155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5665135f3efae36b172f6dd2357fda7c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4f84452f71e8b3126a9c89db44eb47c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_528c6acb321f8dfda29977c6aecafb12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d688648828ee29eacbb51229341012b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1dbf0999962e0e57825201d5c8286e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4c0e7d66f37e684086763253d4ada90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf30972b5b5b525eb74d95f4aacbaa9c |
| publicationDate |
2019-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102012111831-B4 |
| titleOfInvention |
Integrated circuit and method for manufacturing an integrated circuit |
| abstract |
An integrated circuit comprising: a base member (6) having a plurality of electronic circuit components in a surface region of a semiconductor substrate (1) and a copper member (2) having copper grains (2a) over the base member (6), the copper member (2) having a thickness of at least 5 pm, and the ratio of the average grain size of the copper grains (2a) of the copper element (2) to the thickness of the copper element (2) is smaller than 0.7, and wherein the modal value of the grain size distribution of the copper grains (2a) of the copper element (2) greater than 2 pm and less than 5 pm. |
| priorityDate |
2011-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |