| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4902
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-585 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2012-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9dd4fc7bf1d3380714c5dc0f5e3fba30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cfed637a530946777b3d133ea05f10a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4226267552a56386e228d311afc687f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a08052450e8e9d4f67aa6e07029842c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_693174f6cbe8da7716381d93e022cdf6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a104500f6f739429ef1141fa7cc31a58 |
| publicationDate |
2013-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102012105177-A1 |
| titleOfInvention |
Induction coil for Post Passivation Interconnect |
| abstract |
An inductor device and a method of forming the inductor device are provided. In some embodiments, the inductor device includes a Post Passivation Interconnect (PPI) layer and a bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to communicate with an electrical coupling element. |
| priorityDate |
2012-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |