| abstract |
The surface mount method of the present invention comprises applying an active resin composition to at least a portion of the surface of a printed circuit board substrate; placing a surface mount component on the printed circuit board substrate; performing a reflow soldering; the introduction of a filling resin in a designated area; performing a vacuum treatment and / or a heating to a temperature lower than the temperature at which the curing reaction starts in the applied active resin composition or in the filling resin, before and / or after the introduction of the filling resin; and thermally curing the applied active resin composition and the filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1 to 50 parts by weight, and / or a carboxylic acid compound in an amount of 1 to 10 parts by weight, and a curing agent which exhibits a curing reaction at 150 ° C or more initiates, in an amount of 1 to 30 parts by weight. |