http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102011113804-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2011-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d10c066f8f78607802c47b4467619242 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c54ef637626c06eeefc16ea474ad25a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb9911eef1b7c41e44a37a9c8ec97fde http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4006e4f69daecf0f4e05e1cade7586f9 |
| publicationDate | 2012-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102011113804-A1 |
| titleOfInvention | An adjustable dielectric polishing selectivity slurry composition and method for polishing a substrate |
| abstract | A chemical-mechanical polishing slurry composition containing as original components water, an abrasive, a halogenated quaternary ammonium compound of the formula (I) wherein R 8 is selected from a C 1-10 alkyl group and a C 1-10 hydroxyalkyl group, wherein X 1 is a halide selected from chloride, bromide, iodide and fluoride wherein R 9 , R 10 and R 11 are each independently selected from a saturated or unsaturated C 1-10 alkyl group, a C 1-10 haloalkyl group, a C 6-15 aryl group, a C 6-15 haloaryl group, a C 6-15 arylalkyl group and a C 6-15 haloarylalkyl, and wherein the anion in the formula (I) can be any anion which is the + - Charge on the cation in formula (I), and optionally comprising a diquaternary substance according to formula (II) wherein each A is independently selected from N and P, wherein R 1 is selected from a saturated or unsaturated C 1 -C 15 - Alkylgru ppe, a C 6 -C 15 aryl group and a C 6 -C 15 aralkyl group, wherein R 2 , R 3 , R 4 , R 5 , R 6 and R 7 are each independently selected from hydrogen, a saturated or unsaturated C C 1 -C 15 alkyl group, C 6 -C 15 aryl group, C 6 -C 15 aralkyl group and C 6 -C 15 alkaryl group, and wherein the anion in formula (II) is any anion or any of Combination of anions which (s) offsets or offsets the 2 + charge on the cation in formula (II). Also provided are methods of making the CMP slurry composition and using the CMP polishing composition to polish a substrate. |
| priorityDate | 2010-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.