| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd446fb0d73aa96d044fea2eaa3c8ebc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7682 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L9-0045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L9-0054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0076 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 |
| filingDate |
2011-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96ef777f34866cab16cef23cfa13273f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_256bb5b38edb89e86e6c52422cbf879f |
| publicationDate |
2013-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102011085084-A1 |
| titleOfInvention |
A method of making an electrical via in a substrate and a substrate having an electrical via |
| abstract |
The invention provides a method for producing an electrical via in a substrate as well as a substrate with an electrical via. The method comprises the following steps: forming a first printed conductor (23; 33) on a first side of a substrate (10; 10a) which has a first contact region (22; 22 ') of the substrate (10; 10a) on the first side (10; V) electrically connected; Forming a second conductive trace (28) on a second side of a substrate (10; 10a) electrically connecting a second contact region (27) of the substrate (10; 10a) on the second side (V); Forming a ring trench (R) in the substrate (10; 10a), forming a substrate punch (17) extending from the first contact region (22; 22 ') toward the second contact region (28); and selectively depositing an electrically conductive layer (16) on an inner side of the ring trench (R), wherein the substrate stamp (17) is coated with the electrically conductive layer (16) and from the surrounding substrate (10; 10a) via the ring trench (R) remains electrically isolated. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102016123861-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017216937-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10643896-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023073025-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10427931-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4174923-A1 |
| priorityDate |
2011-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |