| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9884b2360f2413d7edea0d5af39f775a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K2102-331
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-854
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-8445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K2102-351 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-841
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-8426 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-52 |
| filingDate |
2011-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b313d41d28a61fcb8088953ecd36caf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e982c74477343ef7872a7170685ce674
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84910414db65ce2f539016980bc7d8da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2979050e7e6ded02d79423b730638f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_737029a62a6c53158e63abe8357d25dd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e549038b45faab14d48893e5e065d860
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46179c2c078a65749942b57a7d65952f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f250ae3dcf64fe5c2b7937aadd30555 |
| publicationDate |
2013-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102011079160-A1 |
| titleOfInvention |
A PLASTIC STRUCTURE FOR AN OPTOELECTRONIC COMPONENT AND METHOD FOR PULPING AN OPTOELECTRONIC COMPONENT |
| abstract |
An encapsulation structure for an optoelectronic component comprises a thin-layer encapsulation for protecting the optoelectronic component from chemical contaminants, an adhesive layer formed on the thin-layer encapsulation, and a cover layer formed on the adhesive layer for protecting the thin-layer encapsulation and / or the optoelectronic component against mechanical damage. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11114648-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015082687-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102014102569-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017117282-A1 |
| priorityDate |
2011-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |