http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102010037813-A1

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filingDate 2010-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102010037813-A1
titleOfInvention A method of manufacturing a sealant of a light emitting diode and cover assembly made by this method
abstract A method for producing a sealing compound for a light-emitting diode and cover arrangement which is produced according to this method, the method comprising the following steps: 1. applying a first sealing compound layer (30); 2. Applying a phosphor powder (40) uniformly to a surface of the first sealing compound layer (30); 3. Application of a second sealing compound layer (31) to the fluorescent powder (40), the first sealing compound layer (30) being completely covered by the second sealing compound layer (31) in such a way that the fluorescent powder (40) reliably between the first and the second sealing compound layer ( 30, 31) is pinched; 4. heating and stamping the above-mentioned parts into a compact assembly; and 5. cutting the compact assembly to form a desired cover assembly.
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Total number of triples: 25.