| abstract |
A process is described for reclaiming sawing liquid consumed in the production of silicon wafers by sawing silicon blocks by means of wire-cutting laps and / or wire-cutting loops. Such a sawing liquid contains at least one liquid and solid particles, the solid particles comprising silicon abrasion, abrasive particles used for sawing, as well as fragments thereof, abrasion from a saw wire used for sawing, as well as optionally additional auxiliaries. In this case, at least part of the liquid is separated from the solid particles. The method is characterized by suspending the silicon abrasion from the abrasive particles by suspending in a liquid suspension medium containing at least one compound selected from alcohol, fatty acids and ionic surfactants and separating it from non-suspended particles by sedimentation. After separation of the sedimented particles, the particles suspended in the supernatant are separated from the suspension fluid. The method is suitable for the recovery of pure silicon, preferably for the production of electronic components. |