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filingDate 2010-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e38a989660298c5391a303eaaf89622c
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publicationDate 2011-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102010001572-A1
titleOfInvention Method of making a via
abstract The invention relates to a method for producing a through-contact, which is simple and inexpensive to carry out and thereby allows a most compliant deposition of the electrically conductive layer. The method comprises the steps of: a) providing a substrate (1), wherein the substrate (1) comprises a functional layer on the surface of a first side (2) and further wherein the substrate (1) comprises a trench (3), wherein the Trench (3) is designed as a slot and from a second, the first side opposite side (4) through the substrate (1) through to the functional layer reaches; b) depositing a conductive layer (6) within the trench (3).
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type http://data.epo.org/linked-data/def/patent/Publication

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