| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2bcaf91101a370a3d64e3190366357f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-471 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 |
| filingDate |
2009-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4d1e124177f09329ed3a81931761a96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_076fc9e8e76fe791342ca09e504fcfa1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b06f500181bdb3c3574ba19279671b91 |
| publicationDate |
2012-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102009020163-B4 |
| titleOfInvention |
Method for interlayer-free bonding of substrates, apparatus for carrying out a plasma treatment and their use |
| abstract |
A method for interlayer-free bonding of at least two semiconductor substrates, wherein a pretreatment is carried out, wherein the plasma is generated by corona discharge between a bonding surface of at least one semiconductor substrate and at least one electrode, wherein a distance between the bonding surface and the electrode between 3 mm and 5 cm with the proviso that the plasma does not touch the bonding surface, and then the semiconductor substrates are bonded and annealed over the bonding surface within 30 minutes after the pretreatment. |
| priorityDate |
2009-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |