http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102009016762-A1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J61-56
filingDate 2009-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a18fc870f81df42505ed819bdc15f73
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publicationDate 2010-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102009016762-A1
titleOfInvention Method and component set for producing electronic assemblies using a potting compound
abstract In a local encapsulation of electronic components in an assembly, a potting chamber is prepared after the assembly of the assembly by a potting, which is reliably sealed to the base plate of the carrier by first performing a first heat treatment based on a first potting compound. In a further step, the potting chamber is then filled with a second potting material, which completely envelops the component.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3122163-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10456851-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019072475-A1
priorityDate 2009-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 25.