| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-264 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 |
| filingDate |
2009-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_886fa648b2663b123b3a7e1cf2b87106 |
| publicationDate |
2009-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102009009275-A1 |
| titleOfInvention |
Sputtering process, sputtering system and chip |
| abstract |
According to an embodiment of the present invention, a sputtering method includes providing a sputtering gas comprising krypton or xenon and accelerating ions of a plasma of the sputtering gas toward a target material. |
| priorityDate |
2008-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |