| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2008-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e688d226f071cbd88f52abd4c7e3c329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d589e6ccd7aa70d9b8f46ca6708914f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7b379c0f81b31bf9586a82ea6200e81 |
| publicationDate |
2009-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102008051542-A1 |
| titleOfInvention |
Integrated circuit device and method |
| abstract |
Onenintegrated circuit component includes a semiconductor chip withna metallization layer on the chip. One from the gas phasendeposited insulating layer is on the metallization layernarranged. |
| priorityDate |
2007-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |