| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 |
| filingDate |
2008-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b24671274ed71d490ef35917a72ad17a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6184f5f2ee3b60eb878bab1d345e7559 |
| publicationDate |
2012-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102008031231-B4 |
| titleOfInvention |
Manufacturing process for planar electronic power electronics modules for high-temperature applications and corresponding power electronics module |
| abstract |
Method for producing a power electronics module having at least one electronic component (1) with the steps: Cutting out at least one opening (5) provided for at least one electrical contacting (7) of the component (1) in an electrically insulating carrier foil (3) having at least one first inorganic material; Positioning and fixing the electronic component (1) on the carrier film (3); Generating the electrical contact (7) to the outside of the electronic component (1), characterized in that For the construction of the module only inorganic or multi-bonded inorganic insulating materials (3, 9) can be used. |
| priorityDate |
2008-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |