http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008031231-A1

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filingDate 2008-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_483f7ac4fbb3b2688045bffccc3b8c9c
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publicationDate 2011-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102008031231-A1
titleOfInvention Planar electrical power electronics modules for high temperature applications and corresponding manufacturing processes
abstract The present invention relates to an electronic component, in particular a power module and a corresponding method for its production or contacting. The invention is characterized in that the component (1) is fastened to an electrically insulating carrier film (3) having at least one first inorganic material, which has at least one opening (5) in which at least one electrical contact (7) of the Component (1) to the outside of the component (1) is provided. In this way, electronic components (1), in particular power modules, for a temperature range of> 175 ° C can be provided.
priorityDate 2008-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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