| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2bcaf91101a370a3d64e3190366357f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-547 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-1804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-022441
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0682 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18 |
| filingDate |
2008-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48bbcea85a1162876b19af71fd25cda9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81e36c3afab9956bef9ca801f031ab10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3534b72c1d24591272293a71d5ada88c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95562d37a7afb3415d7b20ba194afad3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87c97298494d7567a3949f69285d4a36 |
| publicationDate |
2009-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102008029107-A1 |
| titleOfInvention |
Method for producing a metal structure on a surface of a semiconductor substrate |
| abstract |
The invention relates to a method for producing a metal structure on a surface of a semiconductor substrate, comprising the following steps: A application of a metal layer, B applying a structuring layer and C removing the structuring layer, wherein, either in a masking process, step B is performed after step A and step C after step B so that the structuring layer at least partially covers the metal layer and after step B the metal layer is removed at the areas not covered by the structuring layer before step C is carried out or carried out in a lift-off process step A after step B and step C after step A, so that the structuring layer is substantially covered by the metal layer and at least in the areas in which the metal layer covers the structuring layer at Execution of step C, the metal layer is detached. It is essential that the structuring layer is produced in step B by means of a hot-melt ink. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2426704-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102010044350-A1 |
| priorityDate |
2008-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |