http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008026886-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2bcaf91101a370a3d64e3190366357f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-042 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B26-0833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00682 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B1-00 |
| filingDate | 2008-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_999fac2e26b1f5b3cdf7499c31c5d451 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bec23360bd6e750d52c867af9a859b9 |
| publicationDate | 2016-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102008026886-B4 |
| titleOfInvention | Process for structuring a wear layer of a substrate |
| abstract | Method for producing a micromechanical structure with the following steps: Providing a pre-structured BSOI wafer as a substrate (140) comprising a wear layer (110), a carrier layer (120) and an intermediate layer (130) disposed between the wear layer (110) and the carrier layer (120), the intermediate layer (130 ) was prestructured during the production of the BSOI wafer in order to expose, at least in one section, a first surface (122) of the carrier layer (120) facing the wear layer (110), wherein the intermediate layer (130) is designed as an etch stop with respect to the materials of the carrier layer (120) and the wear layer (110); and Generating a micromechanical structure in the wear layer (110) of the substrate (140), wherein generating the micromechanical structure comprises etching the thickness of the wear layer (110) to a predetermined thickness in at least a portion of the micromechanical structure - The wear layer (110) comprises a in the wear layer (110) integrated stop layer which defines the predetermined thickness of the wear layer (110), or - The predetermined thickness of the wear layer is set by the duration of the etching, or During the step of reducing the thickness of the wear layer (110) is monitored by an optical end point control, wherein the reduction is terminated when the predetermined thickness is reached, wherein, starting from a second surface (124) of the carrier layer (120) opposite to the first surface (122), the thickness of the wear layer (110) at those locations (121) at which the intermediate layer (130) is removed, on the predetermined thickness (126) is reduced. |
| priorityDate | 2008-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.