http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008014690-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6538f162d05340e3105c65bbd7c455b7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-161 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 2008-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99fd63274a8d87dd4894df5f306986b6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc8c97969ee09d5600f7a1cb70d704b7 |
| publicationDate | 2009-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102008014690-A1 |
| titleOfInvention | Process for the production of circuit carriers |
| abstract | The invention relates to a method for the automated production of circuit carriers, comprising the steps of: providing a substrate (1) for accommodating electronic components (2), applying an electrically conductive, metal-containing base structure (3) on the substrate (1) by means of electronic components (2) on the substrate (1) are interconnected and - applying electrically conductive, metal-containing Leitkleberstrukturen (4) on the substrate (1), by means of which the electronic components (2) are electrically conductively connected to the base structure (3) , In this case, the conductive adhesive structures (4) are optically differentiated from the base structure (3) by virtue of the fact that a colored, electrically conductive, metal-containing conductive adhesive is used for the automated optical control of the electrically conductive, metal-containing conductive adhesive structures (4) and the electrically conductive, metal-containing base structure (3) the Leitkleberstruktur is applied to the substrate (1), so that a to automated optical control of Leitkleberstrukturen (4) and the base structure (3) necessary contrast between the Leitkleberstrukturen (4) and the base structure (3) is produced. |
| priorityDate | 2008-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.