| abstract |
The invention relates to a cooling box (1) for electrical or electronic components or circuits made of a material, wherein the cooling box (1) is electrically non-conductive or almost non-conductive, one-piece or multi-piece and has a cavity surrounded by the material cavity (4) and this cavity (4) is closed or provided with at least one opening (2). To improve the heat dissipation, it is proposed that at least one surface area of the cooling box (1) is defined by the functions electrical and / or thermal conductivity. |