| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d34fa1d0e297c04904926b0a787ecab1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14685
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-18 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2007-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_033f054fcf6eecb61a182e058faabcf3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abc86ae7d0e767694d930a0acbf61221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_987ef62ad5b70ff502e70b08a2f73989 |
| publicationDate |
2008-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102007063342-A1 |
| titleOfInvention |
Semiconductor package (WLP) with die-receiving bore and method for its production |
| abstract |
The present invention discloses a structure in the die receiving bore, a connecting throughbore structure, and a first contact terminal; a die having a microlens portion disposed in the die receiving bore; a transparent cover covering the microlens area; a surrounding material formed under the die and formed in the gap between the die and the side wall of the die receiving bore; a dielectric layer formed on the die and the substrate exposing the microlens area; a redistribution layer (RDL) formed on the dielectric layer and thus coupled to the die; a protective layer formed over the RDL; and a second terminal contact disposed on the lower surface of the substrate and below the connection through-hole. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11245863-B2 |
| priorityDate |
2006-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |