| abstract |
Support structure for an electronic power module (1) comprising at least a) a bottom plate (3) with a bottom plate top (10) and b) an electrically insulating carrier layer (4) having a carrier layer underside (11) and having a carrier layer upper side (12) serving as a base for a further subassembly for mounting at least one component (6) of the electronic power module (1), c) wherein the bottom plate (3) and the carrier layer (4) are directly connected to each other, so that the bottom plate top side (10) and the carrier layer underside (11) directly adjoin one another, d) between the bottom plate (3) and the carrier layer (4) consists of a solid compound, which is based on at least one type of connection from the group of frictional connection, positive connection and material connection, and e) the carrier layer (4) consists of a multiplicity of carrier-layer material particles applied to the bottom plate (3) under kinetic and / or thermal energy supply, wherein the carrier-layer material particles have a preferential orientation and are arranged inside the carrier layer (4) so that they can intermesh with them Preferential orientation largely uniformly aligned ... |