| abstract |
A MEMS package is proposed, in which a chip, which has MEMS structures on its upper side, is connected to a rigid cover plate and a frame structure comprising a polymer in such a sandwich structure that a MEMS structures receiving closed cavity is formed. On the back of the chip or on the side facing away from the chip outside of the cover plate solderable or bondable electrical contacts are arranged, which are electrically connected via an electrical connection structure with at least one pad. |