| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7682
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2007-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e2d551647b4fa735adb07444c7552e1 |
| publicationDate |
2008-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102007043710-A1 |
| titleOfInvention |
A deep via structure for a semiconductor device and a method of making the same |
| abstract |
AnSemiconductor integrated circuit device has a substratenand a deep via in the substrate, one in the deepnPlated metal fill, which defines an upper surface,nand a connection wiring. The contact surface electrically connects the metal fillingnwith the connection wiring, wherein the contact surface laterally ofnthe deep via is arranged so that the contact surface nonContact with the upper surfacenthe metal fillingnHas. |
| priorityDate |
2006-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |