| abstract |
AnWafer-level packaged IC is made by placing a lid wafernis attached to the front of an IC base wafer before the IC base wafernis cut, i. before the variety of chips or dies onnthe IC base wafer is singulated. The lid wafer becomes mechanicalnattached to and electrically connected to the IC base wafer,nand the chips or dies are singulated. Electrically conductive waysnor paths extend through the lid wafer between wafer contact padsnon the front surfacenof the lid and electrical contact points on the IC base wafer.nOptionally containsnthe lid wafer one or more chips or Dies. The IC base waferncan according to another technology than the lid wafer produced, therebyna hybrid packaging is formed at the wafer level. OptionalncannadditionalnLid wafer "on highernLevel "(with or without chips or dies) to be stackedn"Multi-level"nTo form IC. Optionally, a hermetically sealed height is provided. |