| abstract |
The invention relates to a resin formulation having at least one crosslinkable bismaleimide component, characterized in that the bismaleimide component comprises bismaleimidophenylindane having the following structural formula: The radicals R1, R2, and R3 are any organic groups. The resin formulation is suitable for the electrical insulation of components in which high temperatures of up to 225 ° C occur during operation. The resin formulation is used for producing an insulating potting compound or an insulating coating of an electrical component, but in particular for producing a film with the following process steps: a) providing the resin formulation, b) molding process of the resin formulation and c) initiating crosslinking the bismaleimide component of the resin formulation to form the film. Finally, a use of the film for the planar contacting of an electrical contact point of an electrical component is specified with the following method steps: a ') providing the component with the contact point, b') lamination of the film to the component, so that the contact point is covered by the film, c ') opening a window in the film so that the contact point of the device is exposed, and d') contacting the contact point through the window. |