| abstract |
ThenThe present invention provides an aqueous compositionnfor polishing silicon dioxide and boron-phosphate-silicate glassnon a semiconductor wafer comprising 0.01 to 5% by weightnCarboxylic acid polymer,n0.02 to 6% by weight of abrasive, 0.01 to 10% by weight of polyvinylpyrrolidone,n0 to 5 wt .-% cationic compound, 0 to 5 wt .-% zwitterionicnCompound and the remainder water, wherein the polyvinylpyrrolidone anaverage molecular weight of 100 g / mol to 1,000,000 g / molnhaving. |