| abstract |
A microstructured electronic component has a semiconductor carrier (2a) on which a microstructured circuit arrangement is applied. On the semiconductor carrier (2a), a plurality of contact portions (3) for contacting with a bonding wire (7) is arranged. The contact sections (3) have the following layer structure: A nickel layer (4) is applied to the semiconductor carrier (2a). On the latter, a palladium layer (5) is applied. On this turn, a gold layer (6) is applied. The result is a module with increased reliability, in particular with increased resistance at higher temperatures and improved thermal cycle stability. |