patent/DE-102006021765-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102006021765-A1

Outgoing Links

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filingDate	2006-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc0aea7e2ad0e3b532d507480056ce48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22401e1be9f92c6b6110bba3676b53f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f23555321a2c37656d9144cb77e1238e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29f6c654899d9f5477adb0b1c8a8b233
publicationDate	2006-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	DE-102006021765-A1
titleOfInvention	Method for producing a printed circuit board with embedded electronic components
abstract	DisclosednHere is a method for manufacturing a printed circuit board with embeddednComponents that are economically advantageous and easy. The procedurenis characterized by the stacking of printed circuit boards, where electronic componentsnhigh density can be mounted to form a core layer, innthe electronics components are embedded, and by the followingnBuild additionalnCircuit layers.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009118249-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1926355-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008009220-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102007044754-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009098033-A1
priorityDate	2005-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 63.