| abstract |
Chip module with A substrate (1) having a chip top side (2) and a contact top side (3) opposite the chip top side (2), A chip (8) mounted on the chip top side (2) of the substrate (1), Contact pads (4) formed on the contact top (3) of the substrate (1) - Intermediate contact elements (13) which are formed on the chip top side (2) of the substrate (1), - Passages (6) formed in the substrate (1), and - At least one Drahtbondverbindung (11, 11 ') which is formed in two parts and wherein the first part (11') on the contact field (4) within the at least one passage (6) attaches and leads to an intermediate contact element (13) and the second Part of the intermediate contact element (13) leads to a terminal contact (9) on the chip (8). |