| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09754
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-1034 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0034 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 |
| filingDate |
2006-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10d62ae74d678520db2cea93657567e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ccb71e0424743e5b7b247fb07dc9ded |
| publicationDate |
2006-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102006018364-A1 |
| titleOfInvention |
Electronic circuit device and method for its manufacture |
| abstract |
Onencasingn(4) an electronic transmitting and receiving device (1) for anelectronic keynis shaped so that itnCircuit parts (3), a mounting surface (21)na circuit board (2) on which the circuit parts (3) attachednare completely wrapped, and portions of terminals (5), while other parts of thenRelease clamps (5). One of the mounting surface (21) facing away backn(22) of the printed circuit board (2) forms part of the outer surface of thenHousing (4).nIf the casen(4) by a pouring methodnis provided with the circuit board (2), the circuit board (2) inna mold cavity (104) of a moldn(100) held so that thenbackn(22) the printed circuit board (2) in close contact with an inner wall (102a)nof the mold cavity (104). Accordingly, deformation of thenPrinted circuit board (2) prevented by the pressure that arises when thenCast resin or hardenednbecomes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009087035-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102012112736-A1 |
| priorityDate |
2005-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |