| abstract |
The invention relates to a power electronics arrangement (2) with an insulating substrate (20), with a cooling element (3) arranged below the insulating substrate and with one or more power electronics components (25) which are attached to a respective metallization surface (22) of the insulating substrate (20) , A metal layer (29) is attached to the surface of the insulating substrate (20) and projects beyond the insulating substrate on all sides. The region of the metal layer projecting beyond the insulating substrate forms a metal rim (21) surrounding the insulating substrate. On its side facing the insulating substrate, the cooling element (3) has one or more recesses below the insulating substrate, as a result of which a cavity (35) for receiving a liquid cooling medium (35) delimited by the insulating substrate (20) and wall surfaces of the one or more recesses 4) is trained. The metal brim (21) is further connected to the cooling element (3). |