| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd446fb0d73aa96d044fea2eaa3c8ebc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0284 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-6845
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-684 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L49-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01F1-684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01F1-692 |
| filingDate |
2005-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0bdee4329bfa3f5c1664ac609dcef18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbc4d3c94065ce3cd8c5ccea7f98017a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b360452dc30fdb359ac633019d23dc1d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea375e30922d978570a4ded34e1783a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d80797d7198bbde190279c8f48301ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd475be58baa0bd57020b96d0511aab5 |
| publicationDate |
2007-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102005036189-A1 |
| titleOfInvention |
Method of making a hot film air mass meter |
| abstract |
ThenThis invention relates to a method of making a hot film air mass metern(110), which is used, for example, to measure air mass flows (134).nused in the intake system (112) of an internal combustion enginencan be. The hot film air mass metern(110) has a hot-film sensor chipn(162). In the method according to the inventionnwill be firstnby means of a plastic molding process, a carrier elementn(146) which has a receptacle (128) for mounting the hot-film sensor chipn(162). Subsequentlynis by means of a MID (Molded Interconnect Device, injection moldednCircuit board) processnat least one conductor track (140) applied to the carrier element (146).nThis at least one trace (140) is in turn in ansubsequentnProcess step at least one electronic component (142)napplied. Subsequentlynbecomes the hot-film sensor chipn(162) in the receptacle (128) applied. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102010020190-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102007041109-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102007041109-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102012210936-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010031647-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008052393-B3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008052404-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2525197-A1 |
| priorityDate |
2005-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |